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Product Specification
Part Name: OEL Display Module Part ID: UG-6028GDEBF01 Doc No.: SAS1-I004-C
Customer:
Approved by
From: Univision Technology Inc.
Approved by
Univision Technology Inc.
8, Kebei RD 2, Science Park, Chu-Nan, Taiwan 350, R.O.C.
Notes: 1. Please contact Univision Technology Inc. before assigning your product based on this module specification 2. The information contained herein is presented merely to indicate the characteristics and performance of our products. No responsibility is assumed by Univision Technology Inc. for any intellectual property claims or other problems that may result from application based on the module described herein.
Univision Technology Inc.
Revised History
Part Number UG-6028GDEBF01 Revision A New Page 1 Page 2 Revision Content Section 1.2 3)
1.67
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Revised on August 1, 2006
Modify Panel Thickness 1.70
Section 1.4
Update Mechanical Drawing from the Applicable COF Number & Pin Definition Modification
Page 3~4 Section 1.5
Update Pin Definition Description
Page 5 Page 6 Page 7 UG-6028GDEBF01 B
Section 1.6 Section 2 Section 3.1 & 3.2 June 9, 2008
Modify Application Circuit Update Absolute Maximum Ratings Reset Optics Characteristics to Section 3.1 Modify C.I.E. White (0.260.04, 0.280.04) (0.300.04, 0.330.04) Red (0.650.04, 0.340.04) (0.640.04, 0.340.04) Green (0.300.04, 0.620.04) (0.310.04, 0.620.04) Blue (0.140.04, 0.190.04) (0.140.04, 0.160.04) Integrate DC Characteristics with General Electrical Characteristics
Page 8~11 Page 12 Page 13 Page 20 Page 2 UG-6028GDEBF01 C
Section 3.3
Update AC Characteristics
Section 4.2.1 Section 4.4 Section 7 Section 1.4 April 9, 2009
Update Power up Sequence Update Initialization Update Package Specifications Update Mechanical Drawing from the Dimension Modification
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Notice:
No part of this material may be reproduces or duplicated in any form or by any means without the written permission of Univision Technology Inc. Univision Technology Inc. reserves the right to make changes to this material without notice. Univision Technology Inc. does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic products under the control of Foreign Exchange and Foreign Trade Law of Taiwan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency. (c) Univision Technology Inc. 2009, All rights reserved. All other product names mentioned herein are trademarks and/or registered trademarks of their respective companies.
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Revision History ................................................................................................... i Notice ................................................................................................................... ii Contents .............................................................................................................. iii 1. Basic Specifications .................................................................................. 1~5
1.1 1.2 1.3 1.4 1.5 1.6 Display Specifications .................................................................................................1 Mechanical Specifications ...........................................................................................1 Active Area & Pixel Construction ...............................................................................1 Mechanical Drawing....................................................................................................2 Pin Definition...............................................................................................................3 Block Diagram .............................................................................................................5
2. Absolute Maximum Ratings .......................................................................... 6 3. Optics & Electrical Characteristics ......................................................... 7~11
3.1 Optics Characteristics ..................................................................................................7 3.2 DC Characteristics .......................................................................................................7 3.3 AC Characteristics .......................................................................................................8 3.3.1 68XX-Series MPU Parallel Interface Timing Characteristics ...........................8 3.3.2 80XX-Series MPU Parallel Interface Timing Characteristics ...........................9 3.3.3 Serial Interface Timing Characteristics ...........................................................10 3.3.4 RGB Interface Timing Characteristics.............................................................11
4. Functional Specification ....................................................................... 12~13
4.1 Commands .................................................................................................................12 4.2 Power down and Power up Sequence ........................................................................12 4.2.1 Power up Sequence ..........................................................................................12 4.2.2 Power down Sequence .....................................................................................12 4.3 Reset Circuit...............................................................................................................12 4.4 Actual Application Example ......................................................................................13
5. Reliability ...................................................................................................... 14
5.1 Contents of Reliability Tests......................................................................................14 5.2 Lifetime......................................................................................................................14 5.3 Failure Check Standard..............................................................................................14
6. Outgoing Quality Control Specifications .............................................. 15~19
6.1 Environment Required ...............................................................................................15 6.2 Sampling Plan ............................................................................................................15 6.3 Criteria & Acceptable Quality Level .........................................................................15 6.3.1 Cosmetic Check (Display Off) in Non-Active Area ........................................15 6.3.2 Cosmetic Check (Display Off) in Active Area.................................................18 6.3.3 Pattern Check (Display On) in Active Area.....................................................19
7. Package Specifications ................................................................................ 20
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8.1 8.2 8.3 8.4 8.5
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8. Precautions When Using These OEL Display Modules ....................... 21~23
Handling Precautions .................................................................................................21 Storage Precautions....................................................................................................22 Designing Precautions ...............................................................................................22 Precautions when disposing of the OEL display modules.........................................23 Other Precautions.......................................................................................................23
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1. Basic Specifications
1.1 Display Specifications 1) 2) 3) Display Mode: Display Color: Drive Duty: Passive Matrix 262,144 Colors (Maximum) 1/128 Duty
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1.2 Mechanical Specifications 1) 2) 3) 4) 5) 6) 7) Outline Drawing: Number of Pixels: Panel Size: Active Area: Pixel Pitch: Pixel Size: Weight: According to the annexed outline drawing 160 (RGB) x 128 39.90 x 34.00 x 1.67 (mm) 33.575 x 26.864 (mm) 0.07 x 0.21 (mm) 0.045 x 0.194 (mm) 4.5 (g)
1.3 Active Area & Pixel Construction
P0.07x(160x3)-0.025=33.575 (Active Area)
0.21 0.185 0.07 0.045
R
G
B
P0.21x128-0.016=26.864 (A/A)
( Column 1 )
( Column 480 )
G127
( Row 128 )
G126
( Row 127 )
G1
( Row 2 )
G0
( Row 1 )
0.21 0.194 Detail "A" Scale (10:1)
S0
S479
1
Remark Original Drawing
Modify Module Thickness Dimension
Modify Polarizer Type
Update Applicable COF Number & Pin Definition
0.50.5 (2.162) (3.162)
E
39.90.2 (Panel Size) 39.90.2 (Cap Size) 38.90.3 (Polarizer) 35.575 (V/A) P0.07x(160x3)-0.025=33.575 (A/A) 10 5 1.670.1
Item A B C D E Modify Active Area Dimension
Date 20060419 20060714 20061127 20080609 20090409
1.4 Mechanical Drawing
(2.1) (1.1) 0.50.5 Remove Tape t=0.15mm Max 8 (23.2) (33.2) Polarizer t=0.2mm (35.5) S0
( Column 1 )
"A"
Active Area 1.69" 160(RGB) x 128 Pixels
(42.7)
S479
( Column 480 )
G127
( Row 128 )
G126
( Row 127 )
G1
( Row 2 )
G0
( Row 1 )
N.C. (GND)
VSDH
VDDH
VSSH
IREF
OSCA2
OSCA1
VDDIO
VSY NCO
VSY NC
HSY NC
DO TCLK
ENABLE
CPU
PS
D17
D16
D15
D14
D13
D12
D11
D10
D9
RS
CSB
RDB
WRB
RESETB
VSS
VDD
VSSH
VDDH
VSDH
N.C. (GND)
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Notes:
The drawing contained herein is the exclusive property of Univision. It is not allowed to copy, reproduce and or disclose in any formats without permission of Univision.
1. Driver IC: SEPS525 2. Die Size: 19660um x 1850um 3. COF Number: SEPS525F00 / UT-0825-F01 4. Interface: 8-/9-bit 80XX Parallel, 4-wire SPI, 6-bit RGB I/F 5. General Tolerance: 0.30 6. The total thickness (1.77 Max) is without p olarizer protective film & remove tape. The actual assembled total thickness with above materials should be 2.05 Max
P0.21x128-0.016=26.864 (A/A) 28.864 (V/A) 310.3 (Polarizer) 320.2 (Cap Size) 340.2 (Panel Size) (48.5) (1.5) Protective Film 30x10x0.055mm Glue (8.7) (5.5) (2.33) 30.5 (Stiffener) 0.21 0.185 0.07 0.045 Contact Side
35
10 14.50.2 2-R0.50.05 0.30.03 0.80 Max
1
(1.67) 0.194 0.21
2.85 4 5
R
G
B
P0.50x(35-1)=170.05 (W0.350.03)
(Reference Mechnical Design)
Detail "A" Scale (10:1)
(3.61)
180.2 30.680.1 (Alignment Hole) 32.680.2
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35
Symbol N.C. (GND) VSDH VDDH VSSH IREF OSCA2 OSCA1 VDDIO VSYNCO VSYNC HSYNC DOTCLK ENABLE CPU PS D17 D16 D15 D14 D13 D12 D11 D10 D9 RS CSB RDB WRB RESETB VSS VDD VSSH VDDH VSDH N.C. (GND)
Customer Approval Signature
Unless Otherwise Specified
Univision Technology Inc.
Unit
General Roughness
Drawing Number DFE6028CNCF08
Rev. E Material mm Title UG-6028GDEBF01 Folding Type OEL Display Module Pixel Number: 160(RGB) x 128, 262144 Colors, COF Package Soda Lime / Polyimide Tolerance 0.3 Dimension Angle 1 By Date Drawn Humphrey Lin 20090409 E.E. Sean Lai 20090409 Panel / E. Ivy Lo 20090409 P.M. Cherry Lin 20090409 Scale 1:1 Sheet 1 of 1 Size A3
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1.5 Pin Definition Pin Number Power Supply Symbol Type
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Function Power Supply for Logic Circuit
31
VDD.
P
This is a voltage supply pin. It must be connected to external source.
Power Supply for Interface Logic Level 8 VDDIO P
This is a voltage supply pin. It should be match with MCU interface voltage level. It must always be equal or lower than VDD.
Ground of Logic Circuit 30 3, 33 VSS VDDH P P
A reference for the logic pins. external ground. It must be connected to
Power Supply for OEL Panel
This is the most positive voltage supply pin of the chip. It must be connected to external source.
Ground of OEL Panel 2, 34 4, 32 Driver Current Reference for Brightness Adjustment 5 IREF I/O
This pin is segment (data) current reference pin. A 68k resistor should be connected between this pin and VSS.
VSDH VSSH
P
These are the ground pins for analog circuits. connected to external ground. VSDH: Segment (Data Driver) VSSH: Common (Scan Driver)
It must be
Fine Adjustment for Oscillation 7 6 OSCA1 OSCA2 I O
The frequency is controlled by external 10k resistor between OSCA1 and OSCA2. The oscillator signal is used for system clock generation. When the external clock mode is selected, OSCA1 is used external clock input.
RGB Interface 9 VSYNCO 10 11 12 13 VSYNC HSYNC DOTCLK ENABLE
O Vertical Synchronization Triggering Signal I Vertical Synchronization Input I I I Horizontal Synchronization Input Dot Clock Input Video Enable Input Select the CPU Type
MCU Interface 14 15 29 CPU PS RESETB I I I
Low: 80XX-Series MCU High: 68XX-Series MCU.
Select Parallel/Serial Interface Type
Low: Serial Interface High: Parallel Interface
Power Reset for Controller and Driver
This pin is reset signal input. When the pin is low, initialization of the chip is executed.
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1.5 Pin Definition (Continued) Pin Number Symbol Type Chip Select 26 25 CSB RS I I
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Function
MCU Interface (Continued)
Low: SEPS525 is selected and can be accessed. High: SEPS525 is not selected and cannot be accessed.
Data/Command Control
Low: Command High: Parameter/Data
Read or Read/Write Enable 27 RDB I
68XX Parallel Interface: Bus Enabled Strobe (Active High) 80XX Parallel Interface: Read Strobe Signal (Active Low) While using SPI, it must be connected to VDD or VSS.
Write or Read/Write Select 28 WRB I
68XX Parallel Interface: Read (Low)/Write (High) Select 80XX Parallel Interface: Write Strobe Signal (Active Low) While using SPI, it must be connected to VDD or VSS.
Host Data Input/Output Bus
These pins are 9-bit bi-directional data bus to be connected to the microprocessor's data bus. PS Description D[17]/SCL: Synchronous Clock Input 0 D[16]/SDI: Serial Data Input D[15]/SDO: Serial Data Output 9-bit Bus: D[17:9] 1 8-bit Bus: D[17:10] While using SPI, the unused pins must be connected to VSS.
16~24
D17~D9
I/O
Reserve Reserved Pin (Supporting Pin) 1, 35 N.C. (GND) The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground.
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1.6 Block Diagram
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Active Area 1.69" 160(RGB) x 128 Pixels
G127
G1
S0
SEPS525
OSCA1 VDDIO VSYNCO VSYNC HSYNC DOTCLK ENABLE CPU PS RS CSB RDB WRB RESETB VSS IREF OSCA2 VSDH VDDH D17 ~ D9 VDDH VSDH C5 C6 VSSH VDD VSSH
R1 C3 C4
R2
C1 C2
MCU Interface Selection: CPU, PS Pins connected to MCU interface: D17~D9, RS, CSB, RDB, WRB, and RESETB Pins connected to RGB interface: D17~D12, VSYNC, HSYNC, DOTCLK, and ENABLE C1, C3, C5: 0.1F C2: 4.7F C4, C6: 4.7F / 25V Tantalum Capacitor R1: 68k R2: 10k
G0
~
~~~
S479
G126
~
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2. Absolute Maximum Ratings
Parameter Supply Voltage for Logic Supply Voltage for I/O Pins Supply Voltage for Display Operating Temperature Storage Temperature Symbol VDD VDDIO VDDH TOP TSTG Min -0.3 -0.3 -0.3 -30 -40 Max 4 4 16 70 80
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Unit V V V C C
Notes 1, 2 1, 2 1, 2 -
Note 1: All the above voltages are on the basis of "VSS = 0V". Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. "Optics & Electrical Characteristics". If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate.
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3. Optics & Electrical Characteristics
3.1 Optics Characteristics Characteristics Brightness (White) C.I.E. (White) C.I.E. (Red) C.I.E. (Green) C.I.E. (Blue) Dark Room Contrast View Angle Symbol Lbr (x) (y) (x) (y) (x) (y) (x) (y) CR Conditions With Polarizer (Note 3) With Polarizer With Polarizer With Polarizer With Polarizer Min 70
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Typ 100
Max Unit 0.34 0.37 0.68 0.38 0.35 0.66 0.18 0.20 degree cd/m2
0.26 0.30 0.29 0.33 0.60 0.64 0.30 0.34 0.27 0.31 0.58 0.62 0.10 0.14 0.12 0.16 - >1000:1 >160 -
* Optical measurement taken at VDD = 2.8V, VDDH = 14V. Software configuration follows Section 4.4 Initialization.
3.2 DC Characteristics Characteristics Supply Voltage for Logic Supply Voltage for Display High Level Input Low Level Input High Level Output Low Level Output Operating Current for VDD Operating Current for VDDH Symbol VDD VDDH VIH VIL VOH1 VOH2 VOL1 VOL2 IDD IDDH IOH = -0.4mA IOH = -0.4mA IOL = -0.1mA IOL = -0.1mA Note 4 Note 5 Note 4 Note 5 Note 3 Conditions Min 2.6 1.6 13.5 0.8xVDD 0 VDD-0.4 Typ 2.8 2.8 14 2.5 2.5 16 27 0.4 3.5 3.5 19 32 Max Unit 3.3 3.3 14.5 VDD 0.4 V V V V V V V A A mA mA
Supply Voltage for I/O Pins VDDIO
Note 3: Brightness (Lbr) and Supply Voltage for Display (VDDH) are subject to the change of the panel characteristics and the customer's request. Note 4: VDD = 2.8V, VDDH = 14V, 50% Display Area Turn on. Note 5: VDD = 2.8V, VDDH = 14V, 100% Display Area Turn on. * Software configuration follows Section 4.4 Initialization.
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3.3 AC Characteristics
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3.3.1 68XX-Series MPU Parallel Interface Timing Characteristics: (VDD = 2.8V, Ta = 25C) Symbol tAH6 tAS6 tCYC6 tELR6 tEHR6 tCYC6 tELW6 tEHW6 tRDD6 tRDH6 tDS6 tDH6 Description Address Setup Timing Address Hold Timing System Cycle Timing Read "L" Pulse Width Read "H" Pulse Width System Cycle Timing Write "L" Pulse Width Write "H" Pulse Width Read Data Output Delay Time Data Hold Timing Data Setup Timing Data Hold Timing
* CL = 15pF
Min Max Unit (Read) (Write) (Read) (Write) 10 5 10 5 200 90 90 100 45 45 0 0 40 10 70 70 ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Port CSB RS
E
D[17:9]
* All the timing reference is 10% and 90% of VDD.
( Read Timing )
( Write Timing ) 8
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3.3.2 80XX-Series MPU Parallel Interface Timing Characteristics: (VDD = 2.8V, Ta = 25C) Symbol tAS8 tAH8 tCYC8 tRDLR8 tRDHR8 tCYC8 tWRLW8 tWRHW8 tRDD8 tRDH8 tDS8 tDH8 Description Address Setup Timing Address Hold Timing System Cycle Timing Read "L" Pulse Width Read "H" Pulse Width System Cycle Timing Write "L" Pulse Width Write "H" Pulse Width Read Data Output Delay Time Data Hold Timing Data Setup Timing Data Hold Timing
* CL = 15pF
Min Max Unit 5 5 200 90 90 100 45 45 0 30 10 60 60 ns ns ns ns ns ns ns ns ns ns ns ns
Port CSB RS RDB
WRB
D[17:9]
* All the timing reference is 10% and 90% of VDD.
( Read Timing )
( Write Timing )
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3.3.3 Serial Interface Timing Characteristics:
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(VDD = 2.8V, Ta = 25C)
Symbol tCYCS tSHW tSLW tDSS tDHS tCSS tCSH tRSS tRSH Item Serial Clock Cycle SCL "L" Pulse Width SCL "H" Pulse Width Data Setup Timing Data Hold Timing CSB-SCL Timing CSB-Hold Timing RS-SCL Timing RS-Hold Timing Min 60 25 25 25 25 25 25 25 25 Max Unit ns ns ns ns ns ns ns ns ns SDI CSB RS SCL Port
* All the timing reference is 10% and 90% of VDD.
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3.3.4 RGB Interface Timing Characteristics:
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(VDD = 2.8V, Ta = 25C)
Symbol tDCYC tDLW tDHW tDS tDH tVLW tHLW Dot Clock Cycle Dot "L" Pulse Width Dot "H" Pulse Width Data Setup Timing Data Hold Timing Vsync Pulse Width Hsync Pulse Width Item Min 100 50 50 5 5 1 1 Max Unit ns ns ns ns ns D[17:12] DOTCLK Port
DOTCLK VSYNC DOTCLK HSYNC
* All the timing reference is 10% and 90% of VDD.
DTST: Setup Time for Data Transmission * VSYNC, HSYNC, ENABLE, and D[17:12] should be transmitted by 3 clocks for one pixel (RGB).
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4. Functional Specification
4.1. Commands Refer to the Technical Manual for the SEPS525 4.2 Power down and Power up Sequence
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To protect OEL panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation. 4.2.1 Power up Sequence: 1. 2. 3. 4. 5. 6. Power up VDD / VDDIO Send Display off command Initialization Clear Screen Power up VDDH Delay 100ms (when VDDH is stable) 7. Send Display on command 4.2.2 Power down Sequence: 1. Send Display off command 2. Power down VDDH 3. Delay 100ms (when VDDH is reach 0 and panel is completely discharges) 4. Power down VDD / VDDIO 4.3 Reset Circuit When RESETB input is low, the chip is initialized with the following status: 1. Frame Frequency: 90Hz 2. Oscillation: Internal Oscillator On 3. DDRAM Write Horizontal Address: MX1 = 0x00, MX2 = 0x9F 4. DDRAM Write Vertical Address: MY1 = 0x00, MY2 = 0x7F 5. Display Data RAM Write: HC = 1, VC = 1, HV = 0 6. RGB Data Swap: Off 7. Row Scan Shift Direction: G0, G1, ... , G126, G127 8. Column Data Shift Direction: S0, S1, ... , S478, S479 9. Display On/Off: Off 10. Panel Display Size: FX1 = 0x00, FX2 = 0x9F, FY1 = 0x00, FY1 = 0x7F 11. Display Data RAM Read Column/Row Address: FAC = 0x00, FAR = 0x00 12. Precharge Time (R/G/B): 0 Clock 13. Precharge Current (R/G/B): 0A 14. Driving Current (R/G/B): 0A
VDD / VDDIO on VDDH on Display on VDDH VDD/VDDIO VSS/Ground
Display off VDDH off VDD / VDDIO off VDDH VDD/VDDIO VSS/Ground
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4.4 Actual Application Example Command usage and explanation of an actual example
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Set REDUCE_CURRENT 0x04, 0x01
Set DRIVING_CURRENT_R 0x10, 0x2F
Set IREF 0x80, 0x00
Set REDUCE_CURRENT 0x04, 0x00
Set DRIVING_CURRENT_G 0x11, 0x31
Set DISPLAY_MODE_SET 0x13, 0x00
Set DISP_ON_OFF 0x06, 0x00
Set DRIVING_CURRENT_B 0x12, 0x1E
Clear Screen
Set OSC_CTL 0x02, 0x01
Set PRECHARGE_TIME_R 0x08, 0x03
Set MX1_ADDR 0x17, 0x00
Set CLOCK_DIV 0x03, 0x09
Set PRECHARGE_TIME_G 0x09, 0x04
Set MX2_ADDR 0x18, 0x9F
Set DUTY 0x28, 0x7F
Set PRECHARGE_TIME_B 0x0A, 0x01
Set MY1_ADDR 0x19, 0x00
Set DSL 0x29, 0x00
Set PRECHARGE_CURRENT_R 0x0B, 0x1A
Set MY2_ADDR 0x1A, 0x7F
Set RGB_IF 0x14, 0x31
Set PRECHARGE_CURRENT_G 0x0C, 0x19
Set DISP_ON_OFF 0x06, 0x01
Set MEMORY_WRITE_MODE 0x16, 0x76
Set PRECHARGE_CURRENT_B 0x0D, 0x0A
If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.
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5. Reliability
5.1 Contents of Reliability Tests Item High Temperature Operation Low Temperature Operation High Temperature Storage Low Temperature Storage Conditions 70C, 240 hrs -30C, 240 hrs 80C, 240 hrs -40C, 240 hrs
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Criteria
The operational functions work.
High Temperature/Humidity Operation 60C, 90% RH, 120 hrs -40C 85C, 24 cycles Thermal Shock 60 mins dwell * The samples used for the above tests do not include polarizer. * No moisture condensation is observed during tests.
5.2 Lifetime End of lifetime is specified as 50% of initial brightness. Parameter Storage Life Time Min 20,000 Max Unit hr hr Condition 100 cd/m2, 50% Checkerboard Ta = 25C, 50% RH Notes 6 Operating Life Time 8,000
Note 6: The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions.
5.3 Failure Check Standard After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 235C; 5515% RH.
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6. Outgoing Quality Control Specifications
6.1 Environment Required Customer's test & measurement are required to be conducted conditions: Temperature: Humidity: Fluorescent Lamp: Distance between the Panel & Lamp: Distance between the Panel & Eyes of the Inspector: Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic.
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under the following 23 5C 55 15 %RH 30W 50 cm 30 cm
6.2 Sampling Plan Level II, Normal Inspection, Single Sampling, MIL-STD-105E
6.3 Criteria & Acceptable Quality Level Partition Major Minor AQL 0.65 1.0 Definition Defects in Pattern Check (Display On) Defects in Cosmetic Check (Display Off)
6.3.1 Cosmetic Check (Display Off) in Non-Active Area Check Item Classification Criteria X > 6 mm (Along with Edge) Y > 1 mm (Perpendicular to edge)
X
Panel General Chipping
Minor
Y
X
Y
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Check Item Classification
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6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued) Criteria Any crack is not allowable.
Panel Crack
Minor
Cupper Exposed (Even Pin or Film)
Minor
Not Allowable by Naked Eye Inspection
Film or Trace Damage
Minor
Not Allowable
Terminal Lead Twist
Minor
Not Allowable
Terminal Lead Broken
Minor
Terminal Lead Prober Mark
Acceptable
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Check Item Classification
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6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued) Criteria NG if any bent lead cause lead shorting.
Minor
Terminal Lead Bent (Not Twist or Broken)
NG for horizontally bent lead more than 50% of its width.
Minor
Glue or Contamination on Pin (Couldn't Be Removed by Alcohol) Ink Marking on Back Side of panel (Exclude on Film)
Minor
Acceptable
Ignore for Any
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6.3.2 Cosmetic Check (Display Off) in Active Area
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It is recommended to execute in clear room environment (class 10k) if actual in necessary. Check Item Classification Any Dirt & Scratch on Acceptable Polarizer's Protective Film Scratches, Fiber, Line-Shape Defect Minor (On Polarizer) Dirt, Black Spot, Foreign Material, Minor (On Polarizer) Criteria Ignore for not Affect the Polarizer W 0.1 Ignore W > 0.1, L 2 n1 L>2 n=0 0.1 Ignore 0.1 < 0.25 n1 0.25 < n=0 0.5 Ignore if no Influence on Display 0.5 < n=0
Dent, Bubbles, White spot (Any Transparent Spot on Polarizer)
Minor
Fingerprint, Flow Mark Minor Not Allowable (On Polarizer) * Protective film should not be tear off when cosmetic check. ** Definition of W & L & (Unit: mm): = (a + b) / 2
L
b: Minor Axis W a: Major Axis
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6.3.3 Pattern Check (Display On) in Active Area Check Item No Display Classification Major
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Criteria Not allowable
Bright Line
Major
Missed Line
Major
Pixel Short
Major
Darker Pixel
Major
Wrong Display
Major
Un-Uniform (Luminance Variation within a Display)
Major
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Univision Technology Inc.
7. Package Specifications
EPE COVER FOAM 351x212x1, ANTISTATIC x 1 Pcs x 1 pcs (Empty)
Doc. www..com No: SAS1-I004-C
16 Pcs Tray Vacuum packing B Module x 15 pcs A Staggered Stacking EPE PROTECTTIVE
Tray 420x285 T=0.8mm
Exsiccator x 2 pcs Brimary Primary Box 4 SET C SET
Wrapped with adhesive tape x 16 pcs B
Vacuum packing bag
EPE PROTECTTIVE 370mm x 280mm x 20mm
CARTON BOX
Label
Primary L450mm x W296 x H110, B wave xC 4Pcs
Univision Technology Inc. Part ID :
Label
Lot ID : Q'ty : QC :
Carton Box L464mm x W313mm x H472mm, AB wave
(Major / Maximum)
Item Holding Trays Total Trays Primary Box (A) (B) (C) 15 16 1~4
Quantity per Primary Box per Primary Box (Including 1 Empty Tray) per Carton (4 as Major / Maximum)
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Univision Technology Inc.
8. Precautions When Using These OEL Display Modules
8.1 Handling Precautions 1) 2) 3)
Doc. www..com No: SAS1-I004-C
4) 5)
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Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module. When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using following adhesion tape. * Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water * Ketone * Aromatic Solvents Hold the OEL display module very carefully when placing the OEL display module onto/into any device. Do not apply excessive stress or pressure to the OEL module. And, do not over bend the film with electrode layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases.
Do not apply stress to the LSI chips and the surrounding molded sections. Do not disassemble nor modify the OEL display module. Do not apply input signals while the logic power is off. Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OEL display modules. * Be sure to ground tools to use or assembly such as soldering irons. * To suppress generation of static electricity, avoid carrying out assembly work under dry environments. * Protective film is being applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film. 11) Protection film is being applied to the surface of the display panel and removes
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Univision Technology Inc.
Doc. www..com No: SAS1-I004-C
the protection film before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5). 12) If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above.
8.2 Storage Precautions 1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Univision Technology Inc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above.
2)
8.3 Designing Precautions 1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen. To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. As for EMI, take necessary measures on the equipment side basically. When fastening the OEL display module, fasten the external plastic housing section. If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. The electric potential to be connected to the rear face of the IC chip should be as follows: SEPS525 * Connection (contact) to any other potential than the above may lead to rupture of the IC.
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8)
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Univision Technology Inc.
8.4 Precautions when disposing of the OEL display modules 1)
Doc. www..com No: SAS1-I004-C
Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations.
8.5 Other Precautions 1) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the COF With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Design the product and installation method so that the OEL driver may be shielded from light in actual usage. * Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design. We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise.
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